High Thermal Conductivity Aluminum Nitride Ceramic Sheet with Low CTE

Aluminum Nitride Ceramic Sheets Applications

• Power Electronics Modules — Aluminum Nitride Sheet for High-Density Power Conversion

  ✅Key Advantages

  1. Higher power density at stable junction temperature
  Aluminum nitride sheet with 140–180 W/m·K thermal conductivity can reduce device junction temperature by 10–20 °C compared with alumina substrates at similar power levels, supporting more compact power modules.

  2. Improved thermal cycling reliability
  The CTE of the AlN ceramic sheet is close to silicon, which helps limit solder fatigue and cracking under repeated thermal cycles in IGBT, SiC or MOSFET modules.

  3. High insulation for elevated bus voltages
  Dielectric strength around 15–17 kV/mm allows aluminum nitride sheets to support higher bus voltages with reduced creepage length compared to lower-grade insulators.

  ✅ Problem Solved

  A European industrial drive manufacturer migrated from alumina substrates to aluminum nitride sheets in a 1.2 kV power module platform. After redesigning the layout on AlN sheets, thermal tests showed an average junction temperature reduction of 12–15 °C at the same load, and field failure analysis indicated module failure rates dropping from about 0.8% to below 0.3% over a one-year production run. The improved thermal margin allowed the customer to increase rated output current by approximately 10% without enlarging the module footprint.

• LED and UV LED Packaging — Aluminum Nitride Ceramic Sheet for High-Power Emitters

  ✅Key Advantages

  1. Stable light output at high drive current
  Aluminum nitride ceramic sheet provides efficient heat spreading under LED and UV LED chips, enabling higher drive current while keeping junction temperature within the design window.

  2. Uniform thermal distribution for multi-die layouts
  The high in-plane thermal conductivity of the AlN sheet supports more uniform temperature across multi-chip arrays, which helps reduce luminous flux imbalance between emitters.

  3. Longer lifetime in UV-C and high-power white LED modules
  Better thermal control at the sheet level slows down lumen depreciation and color shift, extending the useful lifetime of high-power LED systems.

  ✅ Problem Solved

  A UV curing system integrator upgraded its 365–405 nm LED module from an alumina-based substrate to a 0.5 mm thick aluminum nitride sheet. Thermal measurements at full drive current showed that board surface temperature dropped by around 11 °C and junction temperature was reduced sufficiently to extend L70 lifetime projections from 10,000 h to roughly 18,000 h. At the same time, the customer reported that bin-to-bin brightness variation decreased, which reduced the number of modules requiring rework during incoming inspection.

• RF and Optical Communication Modules — AlN Ceramic Sheet for Stable Signal Performance

  ✅Key Advantages

  1. Thermally stable base for RF amplifiers
  AlN ceramic sheet offers high thermal conductivity with a dielectric constant typically around 8–9, supporting RF amplifier designs where both thermal and electrical behavior must remain stable.

  2. Controlled CTE for laser and optical transceivers
  The CTE of aluminum nitride supports dimensional stability under temperature swings in laser diode and optical transceiver modules, helping maintain optical alignment.

  3. Insulation for compact high-voltage sections
  High dielectric strength and resistivity allow RF and high-speed optical modules to combine signal paths, bias circuits and ground planes on compact AlN sheets without compromising isolation.

  ✅ Problem Solved

  An RF power amplifier module supplier used aluminum nitride sheets as the carrier for its new 5G band amplifier line. Thermal testing showed that device case temperature under peak load dropped by approximately 9 °C. At the same time, long-term RF performance testing over 1000 thermal cycles demonstrated stable gain and output power without noticeable drift attributed to substrate movement. In a separate optical transceiver project, the same supplier adopted thin AlN sheets for laser packages and reported a reduction in realignment rework by roughly 30% during module assembly.

Aluminum Nitride Sheet Usage Instructions

• Installation

  1. Verify that aluminum nitride sheets are free of visible cracks, edge chips outside the agreed limits, and contamination before assembly.
  2. Handle sheets with clean gloves or finger cots to avoid fingerprints and particles on functional surfaces.
  3. Place the AlN ceramic sheet on a flat reference surface or fixture before bonding chips or soldering leads.
  4. Use compatible solders, brazes or adhesives that match the thermal expansion of aluminum nitride and connected materials.
  5. Avoid local point loads on corners or edges when installing screws, clamps or spring contacts.

• Operation

  1. Ensure that the aluminum nitride sheet is always used together with a controlled thermal interface material between the sheet and the heat sink or baseplate.
  2. Respect the specified maximum operating temperature and power dissipation limits of the module; do not rely solely on the substrate margin.
  3. Monitor device temperatures during initial prototype runs to verify that the thermal design assumptions are met.

•  Storage

  1. Store AlN ceramic sheets in their original trays and bags in a clean, dry environment.
  2. Avoid high humidity, condensation and rapid temperature swings that might lead to corrosion on metalized or attached parts.
  3. Keep sheets separated from hard metal parts and sharp tools to prevent accidental chipping.

•  Cleaning and Handling

  1. Blow off light particles with filtered, oil-free compressed air or nitrogen.
  2. For more persistent contamination, use compatible solvents or deionized water with soft, lint-free wipes; avoid abrasive pads.
  3. Do not subject aluminum nitride sheets to strong mechanical shocks, bending or twisting during cleaning or inspection.

• Common Mistakes and How to Address Them

  1. Excessive clamp force on edges
  Issue: Over-tightening clamps on the edges of the aluminum nitride sheet can cause micro-cracks.
  Solution: Use torque-limited fasteners or spring elements, and clamp closer to zones with mechanical support underneath.

  2. Uneven thermal interface under the sheet
  Issue: Incomplete or uneven thermal interface material coverage leads to hotspots and higher junction temperature.
  Solution: Apply controlled TIM thickness, verify contact with thermal imaging or temperature mapping during validation.

  3. Using generic solder pastes without checking compatibility
  Issue: Solder alloys with very different thermal expansion behavior or insufficient wetting may crack during cycling.
  Solution: Select solder systems with proven compatibility to AlN and the device metallization, and qualify the process through thermal cycling tests before mass production.

FAQ – Aluminum Nitride Sheet

1. Q: What is an aluminum nitride sheet used for?
   A: Aluminum nitride sheet is used as a thermally conductive, electrically insulating ceramic base in power modules, LED and UV LED packages, RF amplifiers and optical communication modules where compact size and efficient heat spreading are required.
2. Q: What thickness range is typical for aluminum nitride ceramic sheets?
   A: Typical aluminum nitride ceramic sheets are supplied in thicknesses from 0.3 mm to about 2.0 mm, with standard preferred values such as 0.32 mm, 0.38 mm, 0.50 mm and 1.0 mm. Thicker or thinner formats can be discussed based on design needs and mechanical constraints.
3. Q: What thermal conductivity can I expect from an AlN ceramic sheet?
   A: Dense aluminum nitride sheet materials commonly provide thermal conductivity in the 140–180 W/m·K range, with some specialized grades reaching even higher values according to published material data.
4. Q: Can aluminum nitride sheets be supplied with precision-ground surfaces?
   A: Yes, aluminum nitride sheets can be delivered with one-sided or two-sided precision ground surfaces to defined roughness and thickness tolerances, which is important for soldering, die attach and thermal interface control.
5. Q: Is it possible to machine holes and complex contours in an aluminum nitride sheet?
   A: Aluminum nitride sheet can be machined with laser cutting, grinding and other ceramic machining processes to add holes, slots and complex outer contours, within limits defined by sheet thickness, minimum feature size and mechanical strength.
6. Q: Can aluminum nitride sheet replace beryllium oxide substrates?
   A: Aluminum nitride sheet is often used as an alternative to beryllium oxide substrates in the electronics industry because it offers high thermal conductivity and electrical insulation without the same level of health concerns during machining and handling.
7. Q:  How can I get the aluminum nitride sheet price?
   A: To receive an accurate aluminum nitride sheet price from us, simply share your dimensions, thickness, tolerance range and any machining details such as holes, slots or required surface finish. If you have a drawing, even a simple sketch is enough for us to evaluate. Pricing is based on the material grade, thermal conductivity requirement and expected order quantity. Once we have these details, we can provide a clear quotation, and for standard sizes we can usually confirm the price right away.

Customer Reviews – Aluminum Nitride Ceramic Sheet

• ⭐️⭐️⭐️⭐️⭐️
  We introduced aluminum nitride sheets into our new inverter platform to increase power density. After switching from alumina, junction temperatures dropped enough to support a higher current rating without changing the housing. Dimensional consistency and flatness of the AlN ceramic sheets helped us stabilize solder thickness across the module.
  -- Michael L., Power Module Engineering Manager, Industrial Drives OEM, Germany
• ⭐️⭐️⭐️⭐️⭐️
  Our UV curing lamps use aluminum nitride ceramic sheets as the base for high-power LED arrays. The thermal behavior has been predictable across multiple batches, and that made it easier to keep intensity and lifetime within the targets we set for industrial customers.
  -- Sarah P., Product Manager, LED UV Systems Manufacturer, USA
• ⭐️⭐️⭐️⭐️⭐️
  In a new RF amplifier project we chose AlN sheets for the carrier because of their thermal conductivity and dielectric properties. The substrate performance allowed us to keep the footprint small while still meeting the thermal margin specified by our reliability team.
  -- Kenji T., RF Design Lead, Communication Equipment Company, Japan
• ⭐️⭐️⭐️⭐️⭐️
  From a sourcing perspective, aluminum nitride ceramic sheets have become a standard item for several product lines. Once we locked down the key dimensions and tolerances, repeat orders have been straightforward and helped us keep a stable material cost structure.
  -- Daniel R., Purchasing Supervisor, Power Electronics Supplier, Canada