High Purity Alumina Electrostatic Chuck (ESC) for PVD / CVD Thin Film Deposition

High purity alumina electrostatic chucks can be supplied for substrate sizes from 100 mm to 300 mm and in round, square or rectangular formats. Typical thickness ranges from 10 mm to 40 mm, and custom designs can incorporate through-holes, backside gas grooves and alignment features according to customer drawings.

Catalogue No. AT-HP-JDP01
Material Al2O3
Continuous service temperature ~900–1000 °C
Volume Resistivity (RT, dry) ≥ 10¹⁴ Ω·cm
Surface Flatness over Clamping Area ≤ 20–30 µm (typical on 150–300 mm class)
24H Standard Dispatch
Small Batch Support OEM
Factory Direct
Expert Engineering Support

A high purity alumina electrostatic chuck is a ceramic clamping plate that uses electrostatic force to hold wafers, glass panels or other flat substrates in place during vacuum, plasma or thermal processing. It is made from high-purity Al₂O₃ as the dielectric body with embedded electrodes and, when a voltage is applied, it generates a controlled electrostatic attraction that stabilises the substrate, supports uniform temperature control and reduces mechanical contact points that can.

High Purity Alumina Electrostatic Chuck Benefits

  • Process-matched electrode layout – Electrode pattern, polarity and clamping area are adapted to the customer’s chamber geometry and process pressure range, improving chucking uniformity and release behaviour.

  • Controlled gas distribution – Backside grooves and gas holes are machined in the alumina body to support helium or process gas distribution, with edge design attention around holes to mitigate local arcing risk.

  • Optimised surface quality – The clamping surface is ground and optionally polished to a specified flatness and roughness, helping to stabilise friction and reduce stiction after plasma or thermal cycles.

  • High purity dielectric body – The alumina composition and firing route are selected for stable resistivity and dielectric strength under repeated thermal cycling, reducing leakage and charging drift.

  • Integration with cooling and mounting features – The chuck can be machined to interface with metallic baseplates, cooling channels and lift-pin modules, simplifying integration into existing vacuum chambers.

High Purity Alumina Electrostatic Chuck Properties

Property Unit 99.5% Al₂O₃ 99.6% Al₂O₃ 99.7% Al₂O₃ 99.8% Al₂O₃ 99.9% Al₂O₃ 99.99% Al₂O₃
Alumina content % 99.5 99.6 99.7 99.8 99.9 99.99
Density g/cm³ 3.89 3.91 3.92 3.93 3.94 3.98
Open porosity % 0
Color Ivory Ivory Ivory Ivory Ivory Ivory
Water absorption % 0 0 0 0 0
Young’s modulus (Elastic modulus) GPa 375 356 357 358 359 362
Shear modulus GPa 152
Bulk modulus GPa 228
Poisson’s ratio 0.22
Compressive strength MPa 2600 2552 2554 2556 2558 2570
Flexural strength MPa 379 312 313 314 315 320
Fracture toughness MPa·m¹ᐟ² 4
Hardness GPa 14.1 (≈1440 kg/mm²) 23 24 25 26 30
Thermal conductivity W/m·K 35 32–37 33–38 34–39 35–40 36–42
Thermal shock resistance ΔT °C 222 223 224 225 228
Maximum use temperature (no load) °C ≤1750 1755 1760 1765 1770 1800
Coefficient of thermal expansion 10⁻⁶/°C 8.4
Specific heat J/kg·K 880
Volume resistivity Ω·cm >1×10¹⁴ >1×10¹⁴ >1×10¹⁴ >1×10¹⁴ >1×10¹⁴ >1×10¹⁴
Dielectric constant (relative permittivity) 9.8 9.83 9.84 9.85 9.86 9.92
Dielectric strength kV/mm 16.9 23.2 23.4 23.6 23.8 24
Dissipation factor (loss factor @ 1 kHz) 0.0002

 

High Purity Alumina Electrostatic Chuck Specifications

High Purity Alumina Electrostatic Chuck
Item No. Diameter (mm) Thickness (mm)
AT-HP-JDP01 Customize

 

High Purity Alumina Electrostatic Chuck Packaging

  • Each high purity alumina electrostatic chuck is first wrapped with clean, non-abrasive protective film to shield the clamping surface from scratches.
  • Cushioning foam or tailored foam inserts surround the ceramic in a rigid inner carton, limiting movement during transport.

High Purity Alumina Electrostatic Chuck Packaging

Application Scenarios – High Purity Alumina Electrostatic Chuck

  • Industrial PVD Coating Systems – High Purity Alumina Electrostatic Chuck

    ✅Key Advantages

    1. Uniform clamping for large-area PVD coating – High purity alumina electrostatic chucks maintain flatness across the substrate so that coating thickness variation can be kept within tight process tolerances.

    2. Stable performance in plasma environments –High purity alumina electrostatic chuck for wafers and glass substrates, supporting custom electrode layouts, gas grooves and flatness for PVD, CVD and R&D tools.

    3. Configurable for multiple substrate formats – Custom chuck geometries allow one coating platform to handle different wafer sizes or glass panels with consistent clamping conditions.

    ✅ Problem Solved

    In industrial PVD lines, unplanned failure of an electrostatic chuck can cause coating non-uniformity, particle-related defects and extended downtime while a replacement is sourced. Industry case studies report that in high-value production tools a single ESC replacement and related downtime can lead to costs in the tens of thousands of dollars per event, motivating careful attention to dielectric design, seal protection and surface quality. A high purity alumina electrostatic chuck designed with controlled gas holes and protected edges helps lower arcing risk and surface damage, reducing the likelihood of such expensive interruptions.

  • R&D and Pilot Vacuum Systems – High Purity Alumina Electrostatic Chuck

    ✅Key Advantages

    1. Flexible clamping platform for process development – Custom electrode and gas groove patterns allow one R&D chamber to support various substrate sizes and test layouts.

    2. Dimensional stability during repeated cycling – The alumina dielectric maintains geometry over repeated heating and cooling cycles, helping researchers compare results across experiments.

    3. Accessible inspection and rework – The ceramic body, gas channels and electrode regions can be inspected and documented, supporting iterative design changes in pilot systems.

    ✅ Problem Solved

    R&D and pilot lines often run many short experiments with different substrates and recipes, which raises the risk of handling damage and process-induced wear on clamping surfaces. When an electrostatic chuck fails, the resulting gap in test capacity can delay process validation and scale-up decisions. By specifying a high purity alumina electrostatic chuck with clear tolerances, defined inspection points and documented maintenance steps, R&D teams can schedule preventative checks and reduce unexpected failures that would otherwise extend project timelines and increase development costs.

  • Vacuum Coating Maintenance and Retrofit – High Purity Alumina Electrostatic Chuck

    ✅  Key Advantages

    1. Drop-in replacements for legacy platforms – High purity alumina electrostatic chucks can be machined to match existing mounting patterns and gas interfaces, supporting quick replacement in legacy chambers.

    2. Design updates to address known failure modes – New chucks can integrate improved edge protection or revised hole geometry to reduce issues seen in earlier generations.

    3. Support for refurbishment workflows – Chucks can be produced in forms that facilitate refurbishment or modular replacement of dielectric sections where the process allows.

    ✅  Problem Solved

    Service providers and in-house maintenance teams often face the challenge of chucks that have reached the end of their service life due to seal erosion, arcing marks or mechanical damage. If a compatible replacement is not available, equipment may remain idle while a solution is engineered. By sourcing a high purity alumina electrostatic chuck designed as a drop-in retrofit based on the original dimensions and failure analysis, maintenance teams can reduce engineering lead time and restore operation more quickly, lowering the total cost associated with each replacement event.

 

Use Guide – High Purity Alumina Electrostatic Chuck

  • Installation

    1. Verify that the baseplate or mounting surface is clean, flat and free of burrs before installing the high purity alumina electrostatic chuck.
    2. Use the specified torque sequence and torque values for mounting bolts to avoid introducing bending stress into the ceramic plate.
    3. Check that gas seals, O-rings and electrical connectors match the intended positions and ratings before the first chamber pump-down.

  • Operation

    1. Bring the chuck to operating temperature following the recommended ramp-up rate to minimise thermal shock to the alumina dielectric.
    2. Apply electrostatic voltage only within the specified range and ensure that the high purity alumina electrostatic chuck is clean and dry before clamping.
    3. Monitor clamp current, leakage current and chuck temperature as part of regular equipment data logging to detect drift over time.

  • Storage

    1. Store spare high purity alumina electrostatic chucks in a clean, dry environment, protected from dust and mechanical impact.
    2. Keep chucks in their protective packaging or on soft supports to avoid edge chipping or surface scratches.

  • Cleaning

    1. Use non-metallic tools and approved cleaning agents to remove process residues from the clamping surface and gas holes.
    2. Avoid abrasive pads or aggressive mechanical scraping that may change surface roughness or introduce micro-cracks.
    3. After wet cleaning, dry the chuck completely before reinstallation to prevent electrical leakage during operation.

  • Safety and Attention Points

    1. Avoid rapid temperature changes that exceed the recommended ramp rate; sudden thermal shock can reduce service life.
    2. Do not exceed the specified electrostatic voltage or polarity configuration for the particular high purity alumina electrostatic chuck design.
    3. Inspect gas holes, seal regions and edges regularly for signs of erosion, discoloration or arcing marks to catch early degradation.

  • Typical User Mistakes and Remedies

    1. Over-tightening mounting bolts – This can warp the ceramic and degrade flatness; use a calibrated torque wrench and cross-pattern tightening, then re-check flatness if available.
    2. Cleaning with hard metal tools – Scrapers can score the surface and create arcing initiation points; switch to plastic tools and non-abrasive cleaners for residue removal.
    3. Restarting with incomplete drying – Remaining moisture in gas holes or micro-cracks can increase leakage; extend dry-out time or perform a controlled bake before high-voltage operation.

FAQ – High Purity Alumina Electrostatic Chuck

  1. Q: What is a high purity alumina electrostatic chuck used for?
    A: A high purity alumina electrostatic chuck is used to electrostatically clamp wafers, glass panels or other flat substrates during vacuum, plasma or thermal processes to improve stability and uniformity.
  2. Q: How does a high purity alumina electrostatic chuck differ from a mechanical clamp?
    A: Instead of relying on clamps at the edge, a high purity alumina electrostatic chuck provides distributed clamping over the entire surface, which reduces shading, vibration and local stress points.
  3. Q: Why choose alumina for the electrostatic chuck dielectric?
    A: Alumina offers high electrical resistivity, dimensional stability and compatibility with vacuum and plasma environments, making it suitable as the dielectric body for many electrostatic chuck designs.
  4. Q: What substrate sizes can a high purity alumina electrostatic chuck support?
    A: Typical designs cover 100 mm to 300 mm wafers and equivalent sizes of glass or metal plates, with geometry and clamping area adjusted to the customer’s substrate format.
  5. Q: Can the high purity alumina electrostatic chuck be customised for existing chambers?
    A: Yes, outer dimensions, bolt patterns, gas groove layouts and electrode configurations can be matched to existing chamber interfaces based on drawings or measured samples.
  6. Q: What are typical failure modes for a high purity alumina electrostatic chuck?
    A: Common issues include seal erosion leading to arcing, surface damage around gas holes, contamination build-up and mechanical chipping at edges if handling is not controlled.

High Purity Alumina Electrostatic Chuck Reviews

  • ⭐️⭐️⭐️⭐️⭐️
    We replaced a legacy clamp with a high purity alumina electrostatic chuck, and substrate positioning became more repeatable across different coating recipes.
    -- Mark L., Process Engineer – Vacuum Coating Line, Germany
  • ⭐️⭐️⭐️⭐️⭐️
    The custom high purity alumina electrostatic chuck matched our chamber interface closely, which reduced installation time on our new PVD platform.
    -- Susan K., Technical Director – Surface Technology OEM, USA
  • ⭐️⭐️⭐️⭐️⭐️
    ADCERAX supported drawing optimisation for our electrostatic chuck retrofit and supplied several units with consistent dimensions, which simplified spare parts planning.
    -- David P., Purchasing Manager – Coating Service Provider, Netherlands
  • ⭐️⭐️⭐️⭐️⭐️
    Having a high purity alumina electrostatic chuck with defined flatness and surface finish helped our team compare thin film test runs without worrying about clamping variability.
    -- Elena R., R&D Lab Manager, Switzerland
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Custom High Purity Alumina Electrostatic Chuck

High purity alumina electrostatic chucks are predominantly custom products, designed around the customer’s chamber, substrate size and process window. Customisation addresses geometry, electrode design, gas distribution and interface to the baseplate or backing structure.

  • Substrate format and size – round wafers from 100–300 mm, square or rectangular panels, special outlines for glass or metal substrates, plus active clamping area definition.

  • Overall geometry of the alumina plate – outer/inner diameters, side lengths, overall thickness, local thickness steps, bevels and corner radii.

  • Electrode configuration – monopolar or bipolar layout, electrode coverage ratio, segmentation for multi-zone clamping, terminal pads, and routing for high-voltage and return lines.

  • Backside gas management – groove pattern, gas hole diameter and pitch, separate zones for helium or process gas, and hole locations relative to lift pins and reference datums.

  • Mounting and alignment details – bolt holes and countersinks, key-slots, alignment notches, dowel pin bores and datum faces that interface with the metal baseplate or stage.

  • Surface specifications on the clamping face – flatness and parallelism limits, roughness range, edge chamfer or radius, and local blending around gas holes and pin openings.

  • Material and dielectric options – standard high purity alumina or higher purity grades, density range, target volume resistivity window and any contamination-related constraints.

  • Thermal and integration features – contact surfaces to cooling plates, required thermal interface area, provisions for lift pins, thermocouples and any embedded sensor windows.

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