A collection of ceramic sputtering targets with different colors, sizes, and surface finishes

Ceramic Sputtering Targets | High-Purity Oxide, Nitride & Carbide Targets for Thin Film Deposition

ADCERAX is a factory-direct supplier of ceramic sputtering targets for thin film deposition. We provide high-purity oxide, nitride, carbide, boride, fluoride, sulfide, and other compound targets for optical coating, display coating, solar coating, and R&D applications, with custom sizes, bonded options, and fast engineering support for lab, pilot, and production needs.

From material selection to custom target delivery, ADCERAX helps turn coating requirements into reliable target solutions.

What is Ceramic Sputtering Target?

A ceramic sputtering target is a high-purity ceramic material used in Physical Vapor Deposition (PVD) processes to create thin films on substrates. When bombarded by energized ions in a vacuum chamber, atoms are ejected from the target surface and deposited onto the substrate, forming functional coatings with controlled thickness, composition, and properties.

Ceramic targets are chosen over metal targets when the deposited film requires:

Electrical insulation (dielectric layers)
Optical transparency (TCO coatings)
Specific optical properties (refractive index, UV absorption)
High-temperature stability
Chemical inertness

Ceramic Sputtering Target Properties

Ceramic sputtering target performance depends on material composition, purity, density, and target structure. The comparison below outlines key properties of different ceramic target materials to help you choose the right option for your deposition process.

Specification Standard Range Notes
Shape Round, Rectangular, Custom Planar and rotary configurations
Round Diameter 1" - 14" (25mm - 355mm) Larger sizes available on request
Rectangular Size Up to 500mm × 200mm Segmented for larger areas
Thickness 3mm - 12mm (typical 6.35mm) Thicker for longer service life
Purity 99.5% - 99.99% Higher purity for semiconductor applications
Density >95% - >99% theoretical density Higher density = fewer defects in films
Surface Finish Ra <1.6 µm (ground), Ra <0.8 µm (polished) Smooth surface for uniform sputtering
Grain Size <50 µm typical Fine grain for stable erosion
Material Density (g/cm³) Melting Point (°C) Thermal Conductivity (W/m·K) Typical Purity
Al₂O₃ 3.95 2072 30-35 99.5-99.99%
ZrO₂ 5.68 2715 2-3 99.5-99.9%
TiO₂ 4.23 1843 8-12 99.9-99.99%
SiO₂ 2.20 1713 1.4 99.99%
ITO 7.14 ~1800 10 99.99%
AZO 5.61 1975 25-30 99.99%

Ceramic Target Types and Products

ADCERAX supplies ceramic sputtering targets in multiple material categories and target formats for thin film deposition and vacuum coating applications. This product range help you identify the right material and target type for their process needs.

Type 1: Oxide Ceramic Targets

Oxide ceramic targets are used in thin film deposition and vacuum coating. They offer different optical, electrical, and thermal properties for a wide range of coating needs.

Zinc Oxide Target from ADCERAX

Zinc Oxide Target

Silicon Dioxide Ceramic Target from ADCERAX

Silicon Dioxide Target

Titanium dioxide sputtering target

Titanium Dioxide Target

Zirconium Dioxide Target from ADCERAX

Zirconium Dioxide Target

Alumina sputtering target from ADCERAX

Aluminum Oxide Target

Close-up of magnesium oxide sputtering target

Magnesium Oxide Target

Indium Dioxide Target from ADCERAX

Indium Oxide Target

Hafnium Oxide Target from ADCERAX

Hafnium Oxide Target

Cerium Oxide Target from ADCERAX

Cerium Oxide Target

Type 2: Nitride Targets

Nitride targets support thin film deposition and vacuum coating. They provide strong thermal stability, hardness, and chemical resistance.

Silicon Nitride Target from ADCERAX

Silicon Nitride Target

Zirconium Nitride Target from ADCERAX

Zirconium Nitride Target

Titanium Nitride Target from ADCERAX

Titanium Nitride Target

Boron Nitride Target from adcerax (2)

Boron Nitride Target

Aluminum Nitride Target from ADCERAX

Aluminum Nitride Target

Type 3: Carbide Targets

Carbide targets stand out for their hardness, wear resistance, and thermal stability. They are often chosen for coating projects that demand stronger material durability.

Tantalum Carbide Target 1

Tantalum Carbide Target

Tungsten Carbide Target 1

Tungsten Carbide Target

Boron Carbide Target 1

Boron Carbide Target

Zirconium Carbide Target 1

Zirconium Carbide Target

Type 4: Boride Targets

Boride targets combine hardness, conductivity, and thermal stability. They are suited to coating projects with higher performance demands.

Titanium Boride Target 1

Titanium Boride Target

Zirconium Diboride Target1

Zirconium Diboride Target

Type 5: Sulfide Targets

Sulfide targets are valued for their optical properties and material versatility. They are often chosen for coating projects that require specific functional film characteristics.

Zinc Sulfide Target 1

Zinc Sulfide Target

Copper Sulfide Target 2

Copper Sulfide Target

Antimony Sulfide Target

Antimony Sulfide Target

Indium Sulfide Sputtering Target

Indium Sulfide Target

Copper(I) Sulfide Sputtering Target

Copper(I) Sulfide Target

Tin Disulfide Sputtering Target

Tin Disulfide Target

Molybdenum Disulfide Sputtering Target12

Molybdenum Disulfide Target

Cadmium Sulfide Sputtering Target2

Cadmium Sulfide Target

Type 6: Selenide Targets

Selenide targets are valued for their optical behavior and functional material properties. They are often selected for coating projects that require more specialized film performance.

Tin Selenide Target 1

Tin Selenide Target

Zinc Selenide Target 1

Zinc Selenide Target

Germanium Diselenide Target 1

Germanium Diselenide Target

Indium Selenide Target1

Indium Selenide Target

Antimony Selenide Target 1

Antimony Selenide Target

Type 7: Other Special Compound Targets

Other special compound targets include fluoride, telluride, lithium-based, and other functional materials. They are used when coating projects require more specific material properties.

W Cerium Oxide Target

Cerium Oxide Target

Magnesium Fluoride Target 2

Magnesium Fluoride Target

Bismuth Telluride Target 1

Bismuth Telluride Target

Lithium Iron Phosphate Sputtering Target

Lithium Iron Phosphate Target

Antimony Telluride Target 2

Antimony Telluride Target

How to Select the Right Ceramic Sputtering Target for Your Process?

The right ceramic sputtering target is not selected by material name alone. Process conditions, purity, density, target format, and bonding requirements all influence coating performance and operating stability.

Copper Sulfide Target 2
• Material System

Choose the target chemistry based on the required film function, such as oxide, nitride, carbide, boride, sulfide, or other functional compounds.

• Target Format

Match the target type to your equipment and process, including planar, rotary, bonded, unbonded, or backing plate options.

• Key Parameters

Review purity, density, flatness, and microstructure to support stable sputtering behavior and consistent film quality.

• Project Stage

Selection priorities may differ for lab testing, pilot runs, and repeat production, especially in target size, utilization, and bonding structure.

Need help selecting the right target?

Send us your material, dimensions, and process requirements for technical support.

Typical Applications of Ceramic Sputtering Targets

Ceramic sputtering targets are used in thin film deposition, optical coating, display coating, solar coating, and other vacuum coating applications. They are also used in research, pilot, and production coating processes.

Optical Coating

Optical coating targets are used in functional films where composition control and stable film formation matter. They are often selected for coatings that require consistent deposition.

Display Coating

A ceramic target for display industry applications is usually evaluated for film quality, target stability, and compatibility with the required coating process.

Thin Film Deposition

A ceramic target for thin film deposition is used to provide controlled material transfer during coating formation and enable repeatable film formation with better process consistency in sputtering processes.

PVD and Magnetron Sputtering

A PVD ceramic target or magnetron sputtering ceramic target is selected according to target material, shape, and sputtering setup. This is often the main process context for industrial and R&D ceramic target inquiries.

Solar Coating

A ceramic target for solar cells may be used in functional films and energy-related coating layers where stable target material and repeatable sputtering behavior are important.

Vacuum Coating and R&D

A vacuum coating ceramic target is often requested by customers working in material development, pilot coating, or specialized industrial film applications that require custom ceramic target support.

Custom Ceramic Targets Built Around Your Process

ADCERAX supports custom ceramic sputtering targets based on your drawing, material system, dimensions, bonding needs, and deposition requirements. From lab trials to repeat production, we help match the right target structure to your process.

Ceramic sputtering target configurations

Send us your drawing, sample, or application requirement to discuss the most suitable ceramic insert customization options.

Custom Ceramic Target Size:

Key Information for Custom Target Review

To review a custom ceramic target project efficiently, the most useful information usually includes:

Drawing or target dimensions
Target material or material system
Target type or bonding requirement
Application or deposition process
Required quantity and tolerance

Frequently Asked Questions About Ceramic Inserts

Sputtering process in high-tech chamber

Compared with metal targets, ceramic targets are typically used when the coating requires oxide, nitride, carbide, boride, fluoride, sulfide, or other compound chemistries that cannot be achieved efficiently with a simple metallic source. Ceramic targets are often selected for functional films that need specific optical, electrical, dielectric, thermal, or chemical properties.

Purity and density both affect sputtering stability and film quality. Higher purity helps reduce contamination in the deposited film. Higher density improves consistency, reduces porosity, and supports more stable erosion. If density is too low or the structure is uneven, the target may cause particle generation, unstable sputtering, or inconsistent coating results. For demanding applications, purity and density should be evaluated together.

Cracking or abnormal erosion may result from:
1. Thermal stress
2. Improper power ramp-up
3. Poor cooling
4. Weak target bonding
5. Internal defects
6. Non-uniform density
7. Unsuitable process settings
Ceramic targets are more brittle than many metal targets, so they are more sensitive to:
1. Thermal shock
2. Mechanical stress during installation
3. Mechanical stress during operation
Other factors that can also affect cracking risk and erosion profile include:
1. Target shape
2. Target thickness
3. Backing plate design
4. Magnetron configuration

Not all ceramic targets need bonding. Bonded targets can improve heat transfer, mounting support, and operating stability in demanding applications.

Yes. Ceramic sputtering targets can be made in custom sizes, thicknesses, and shapes. Common options include disc, rectangular, rotary, bonded, and backing plate targets. In custom projects, material, density, tolerance, flatness, and bonding structure should also be reviewed.

Target utilization affects real coating cost, not just target price. Poor utilization can increase waste, changeover frequency, and process cost, while good utilization helps improve efficiency and cost control.

Common ceramic target formats include:
💠Planar targets: Flat targets commonly used in laboratory systems and standard sputtering setups.
💠Rotary targets: Cylindrical or tube-based targets designed for longer runs and higher material utilization.
💠Bonded targets: Targets attached to a backing plate or support structure for better thermal and mechanical performance.
💠Unbonded targets: Targets used directly without a backing structure. The right format depends on: Equipment design Target size Thermal load Desired utilization Process stability requirements

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