Aluminum Nitride Ceramic Packaging Shell for SiC and IGBT Power Modules

Applications of AlN Ceramic Packaging Shells

• Power Electronics Modules – Aluminum Nitride Ceramic Packaging Shell for SiC and IGBT

  ✅Key Advantages

  1. High heat flux management – The aluminum nitride ceramic packaging shell supports power densities above 80–100 W/cm² by combining a high thermal conductivity base with short thermal paths from die to heat sink.
  2. Stable operation over long thermal cycles – CTE matching between the AlN shell and SiC or IGBT chips reduces solder fatigue during more than 10⁴–10⁵ thermal cycles between typical operating temperatures.
  3. Optimized creepage and clearance – The cavity and sidewalls can be designed to maintain required creepage distances at working voltages in the 600–1700 V range without oversizing the module.

  ✅ Problem Solved

  A drive inverter manufacturer running SiC modules at 1200 V observed field returns due to solder fatigue in alumina-based packages when inverter output reached 50 kW per cabinet. By switching the high-power modules to an aluminum nitride ceramic packaging shell with a thermal conductivity close to 180 W/m·K, junction temperature under full load dropped by around 10–15 °C. Internal qualification over 20,000 thermal cycles showed a reduction in solder crack occurrence from roughly 6–7% of samples to less than 1%, while module dimensions remained compatible with the existing heat sink platform.

• RF and Microwave Power Devices – AlN Ceramic Package Shell for GaN Amplifiers

  ✅Key Advantages

  1. Low-loss ceramic housing – The AlN ceramic package shell provides a stable, low-loss dielectric environment for GaN and GaAs RF devices operating up to multi-GHz frequencies.
  2. Efficient heat spreading under RF hotspots – The high thermal conductivity of the aluminum nitride ceramic packaging shell reduces temperature rise under RF hotspots where local power density can exceed 20–40 W/mm of gate width.
  3. Fine metallization pattern compatibility – Surface quality and planarity support fine-pitch metallization and bonding pads needed for RF matching networks and multi-chip assemblies.

  ✅ Problem Solved

  A RF module supplier for communication base stations upgraded from alumina hybrid packages to aluminum nitride ceramic packaging shells for a series of GaN power amplifiers. Thermal simulation and measurement showed that under a 150 W output stage the maximum case temperature fell by around 8–10 °C. At the same time, the AlN shell allowed closer routing of ground and RF pads without exceeding dielectric stress limits, enabling a more compact RF layout. Over a 1,000-hour accelerated life test, gain and output power drift stayed within the RF customer’s specification without additional derating of the module.

• High-Power LED and Automotive Lighting – Aluminum Nitride Ceramic Housing for LED Modules

  ✅Key Advantages

  1. Improved lumen maintenance – By using an aluminum nitride ceramic housing, LED junction temperature can be reduced by 5–10 °C compared with alumina carriers at similar drive currents, supporting higher lumen maintenance over lifetime.
  2. Compact high-current LED arrays – The AlN package shell allows tighter LED spacing and higher drive currents while keeping case temperature within the limits of automotive and industrial lighting standards.
  3. Dimensional stability for optical alignment – Tight control of cavity and base flatness keeps optical alignment tolerance within a few tenths of a millimeter over the luminaire operating temperature range.

  ✅ Problem Solved

  An automotive lighting supplier developing a compact headlamp module needed to drive a multi-chip LED array above 1 A per emitter while keeping lumen depreciation after 2,000 hours below a defined threshold. Using an aluminum nitride ceramic packaging shell with a high-conductivity base, the LED board temperature at rated current dropped from around 115 °C to about 105 °C compared with the previous alumina design. Accelerated lumen maintenance tests showed that light output after 2,000 hours improved by roughly 3–5%, and the housing dimensions stayed within the optical alignment tolerance window during thermal cycling between cold-start and full operating temperature.

AlN Ceramic Packaging Shells Usage Instructions

• Installation

  1. Check incoming shells for visible edge chips, cracks or deformation before assembly; segregate any units with visible defects.
  2. Use flat, clean fixtures to support the aluminum nitride ceramic packaging shell during die attach so that bending stresses do not exceed design limits.
  3. Align the shell with mechanical datums or fiducials defined on the drawing to keep cavity and pad positions within bonding and lid sealing tolerances.

• Operation and Assembly

  1. Select die attach materials (solder, sintered silver or conductive adhesive) with compatible processing temperatures and CTE for aluminum nitride.
  2. Control temperature ramp rates during die attach, wire bonding and lid sealing to avoid excessive thermal shock; typical ramp rates are kept within a few °C per second.
  3. Ensure that process residues are removed from the cavity and sealing surfaces before final closing to maintain insulation resistance and possible hermetic performance.

• Storage

  1. Store aluminum nitride ceramic packaging shells in dry, clean conditions, ideally below 60% relative humidity and at stable room temperature.
  2. Keep shells in original trays or carriers to avoid uncontrolled stacking or contact that may cause micro-chipping on edges.
  3. Separate unfinished shells from those that have already been metallized or plated, to reduce contamination risk.

• Cleaning

  1. Use non-abrasive cleaning methods such as filtered air blow-off, ultrasonic cleaning in suitable solvents, or deionized water rinsing when compatible with the metallization system.
  2. Avoid aggressive mechanical brushing or hard tools on sealing rims and metallized areas, which may damage surface finish or remove thin metal layers.
  3. Dry components thoroughly after wet cleaning to prevent spotting, residues or corrosion on metal regions.

• Precautions and Typical Misuse Points

  1. Thermal shock from rapid heating or cooling
  Problem: Moving the aluminum nitride ceramic packaging shell directly from low storage temperatures to peak process temperatures or cooling it too quickly can introduce thermal stress.
  Solution: Implement controlled pre-heat stages and limit ramp rate to the values validated in your process window.

  2. Over-tight clamping during assembly
  Problem: Excessive clamping force on corners or uneven support can cause micro-cracks or permanent warpage of the shell.
  Solution: Use flat, compliant fixtures and distribute clamping forces uniformly across the base, within the mechanical limits defined by your design.

  3. Contamination of cavity and sealing rim
  Problem: Flux residues, particles or fingerprints on the sealing surface can compromise insulation resistance and lid sealing quality.
  Solution: Apply defined cleaning procedures before final assembly, introduce handling rules with gloves, and verify surfaces under appropriate inspection before closure.

FAQ – Aluminum Nitride Ceramic Packaging Shell

1. Q: How does an aluminum nitride ceramic packaging shell compare with an alumina package?
   A: Compared with alumina packages, an aluminum nitride ceramic packaging shell typically provides a thermal conductivity in the 170–200 W/m·K range instead of 20–30 W/m·K, while keeping similar dielectric strength. This allows higher power density or lower junction temperature for the same module footprint.
2. Q: What standard sizes are available for AlN ceramic packages?
   A: Standard aluminum nitride ceramic packaging shell sizes usually cover small packages around 5 × 5 mm up to module-class shells in the 50–80 mm range. Many OEMs still choose custom footprints and cavity depths, so it is common to adapt dimensions to a specific module layout rather than rely only on catalog sizes.
3. Q: Can ADCERAX supply fully custom aluminum nitride ceramic packaging shells?
   A: Yes, ADCERAX can produce custom aluminum nitride ceramic packaging shell designs based on 2D drawings or 3D models, including specific cavity shapes, step features and pad locations. Dimensional tolerances and inspection criteria can be set according to the customer’s internal standards.
4. Q: What is the maximum recommended operating temperature for an AlN packaging shell?
   A: In many designs, the aluminum nitride ceramic packaging shell is suitable for continuous operation in the 200–300 °C range at the ceramic level, with junction temperatures defined by the device manufacturer. The exact temperature limit depends on the selected metallization, solder and lid materials in the package stack.
5. Q: What information is needed to request a quotation for AlN ceramic packaging shells?
   A: To quote an aluminum nitride ceramic packaging shell, suppliers typically need a dimensional drawing or 3D file, material and metallization requirements, annual volume, inspection needs and any special flatness or leak-tightness specifications. Providing the thermal design target can also help optimize base thickness and cavity layout.

Customer Reviews – Aluminum Nitride Ceramic Packaging Shell

• ⭐️⭐️⭐️⭐️⭐️
  We used the aluminum nitride ceramic packaging shell from ADCERAX in a 75 kW inverter project. The new AlN ceramic package helped reduce measured junction temperature by around 10 °C compared with the previous alumina housing, and the cavity tolerances were stable across the first 5,000 pieces.
  -- Michael L., Power Electronics Engineering Manager, DriveTech GmbH
• ⭐️⭐️⭐️⭐️⭐️
  For our GaN RF power amplifiers we needed an AlN ceramic package shell with precise cavity depth and pad locations. The aluminum nitride ceramic packaging shells matched our drawings closely, and the surface finish worked well with our metallization and wire bonding processes.
  -- Sarah T., RF Module Design Lead, NovaWave Systems Ltd.
• ⭐️⭐️⭐️⭐️⭐️
  ADCERAX supplied custom aluminum nitride ceramic packaging shells for our SiC driver modules in several frame sizes. The combination of consistent dimensions and competitive pricing allowed us to standardize across multiple product families without redesigning the heat sink interface.
  -- Kenji M., Purchasing Supervisor, Industrial Controls OEM, Japan
• ⭐️⭐️⭐️⭐️⭐️
  “We adopted aluminum nitride ceramic housing for a compact automotive headlamp module. After switching to the new metallized AlN ceramic package, our thermal tests showed lower case temperature and more stable alignment of the optical elements over the full operating temperature range.
  -- Laura R., Optoelectronics Product Manager, Lumenix Lighting Corp.