Metalized Aluminum Nitride Substrate for LED and IGBT Modules – Custom Sizes Available

Applications of Metalized Aluminum Nitride Substrates

• Power Electronics Modules and Inverters

  ✅Key Advantages

  1. High heat flux handling – Metalized aluminum nitride substrate supports power density in the range of several tens of W/cm² by combining high thermal conductivity and short heat paths.
  2. Compact high-voltage insulation – The metalized AlN substrate allows high DC bus voltages in a compact footprint due to its high dielectric strength.
  3. Stable cycling performance – The CTE match between AlN and SiC chips reduces solder fatigue and substrate cracking during thousands of thermal cycles.

  ✅ Problem Solved

  An industrial inverter manufacturer replaced an alumina-based power substrate with a metalized aluminum nitride substrate in a 30 kW drive module. Thermal simulations and tests showed a junction temperature reduction of around 12 °C at full load, allowing the design to meet a 20-year service life target under daily cycling. Assembly scrap related to substrate warpage fell by nearly 30%, and the module footprint was reduced by about 15% while keeping the same rated current and voltage.

• RF and 5G Power Amplifier Modules

  ✅Key Advantages

  1. Low thermal resistance under RF loads – The metalized AlN substrate dissipates heat from RF dies with high local power density, supporting stable output at elevated ambient temperatures.
  2. Fine-line RF interconnects – Metallized AlN supports precise line width and spacing for RF matching networks while maintaining mechanical strength.
  3. Controlled dielectric environment – The ceramic body of the metalized aluminum nitride substrate provides stable dielectric properties for consistent RF performance.

  ✅ Problem Solved

  A 5G base station RF module integrator moved from a metal-core PCB to a metalized AlN substrate for the final stage power amplifier board. At a given output power, the case temperature dropped by approximately 8 °C, and gain variation over temperature was reduced. The customer also reported a reduction of rework events linked to delamination and pad lifting, with RF module field returns falling by more than 20% in the first year after the switch.

• High-Power LED, UV LED and Laser Drivers

  ✅Key Advantages

  1. Efficient LED junction cooling – Metalized aluminum nitride substrate spreads heat from densely packed LED or laser chips, keeping junction temperatures within specified limits.
  2. Reliable wire bonding pads – The metallized AlN substrate provides bondable pad surfaces compatible with common wire materials and bonding conditions.
  3. Compact optical modules – High thermal performance of the metalized AlN substrate allows smaller heat sinks or higher luminous flux in the same package.

  ✅ Problem Solved

  A UV curing equipment builder redesigned its 365 nm LED array board to use a metalized aluminum nitride substrate instead of a metal-core PCB. At the same electrical input, optical output increased by about 10% due to lower LED junction temperature, and lumen maintenance exceeded 90% after 2,000 hours of accelerated life testing. Module warranty returns related to LED failures dropped to less than 1% of shipped units in the first production year.

Metalized AlN Substrates Usage Instructions

• Installation

  1. Check incoming inspection data for dimensions, flatness and metallization before the first assembly run.
  2. Keep the metalized aluminum nitride substrate in clean trays during loading to avoid particle contamination on pads.
  3. Use alignment tooling that supports the underside of the substrate to limit bending and local stress.

•  Use in Assembly and Operation

  1. Select compatible solder paste or sintered silver paste according to the metallization stack on the metalized AlN substrate.
  2. Control heating and cooling ramps during reflow or sintering processes within the limits recommended for AlN ceramics to minimize thermal shock.
  3. For high-voltage modules, verify creepage and clearance distances on the metalized patterns against system requirements after final layout.

• Storage

  1. Store metalized aluminum nitride substrates in dry, clean conditions away from corrosive atmospheres.
  2. Keep original trays and inner bags closed until just before assembly to reduce handling damage.
  3. For long-term storage, record lot numbers and dates to support traceability and process correlation.\

• Cleaning and Maintenance

  1. If cleaning is required, use mild, residue-free cleaning media compatible with the metallization and avoid hard mechanical scrubbing.
  2. Dry substrates completely after wet cleaning before applying paste or adhesives.
  3. Do not reuse substrates that show cracks, edge chips near critical pads or warped surfaces beyond specified flatness.

• Common Handling Errors and Corrective Actions

  1. Issue: Substrate cracking after reflow
  Cause: Heating and cooling ramps too steep for the metalized AlN substrate.
  Solution: Reduce thermal shock by lowering ramp rates and aligning the profile with the ceramic and joining materials limits.

  2. Issue: Poor wetting on some pads
  Cause: Contamination or oxidation on the metalized surface, or paste compatibility issues.
  Solution: Confirm storage conditions, review cleaning procedures and verify that the paste system matches the metallization stack used on the metalized aluminum nitride substrate.

  3. Issue: Warpage causing placement misalignment
  Cause: Uneven clamping or asymmetric metal coverage on large panels.
  Solution: Support the entire metalized AlN substrate during processing, review panel design for more balanced metal areas and consider adjusting thickness for large formats.

AlN Substrates Metallized FAQ

1. Q: What is a metalized aluminum nitride substrate used for in power electronics?
   A: A metalized aluminum nitride substrate is used as a high thermal conductivity, electrically insulating base for mounting power semiconductor dies, forming interconnects and transferring heat to heat sinks in modules and inverters.
2. Q: How does a metalized AlN substrate compare with a metalized alumina substrate?
   A: A metalized AlN substrate typically offers much higher thermal conductivity than metalized alumina, which supports higher power density or lower junction temperature, while keeping similar mechanical handling.
3. Q: Can the metal patterns on a metalized aluminum nitride substrate follow my existing Gerber files?
   A: Yes, the metalized AlN substrate can be produced according to customer Gerber and drawing data, including pad shapes, trace routes, clearance zones and via locations.
4. Q: Is a metalized AlN substrate suitable for high-voltage isolation?
   A: The metalized aluminum nitride substrate provides high dielectric strength through the ceramic body, allowing high-voltage isolation in compact layouts when clearances and creepage distances are designed correctly.
5. Q: Can a metalized aluminum nitride substrate be used for RF and microwave modules?
   A: Yes, a metalized AlN substrate can host RF power devices and matching networks, combining suitable dielectric properties with good thermal performance for high-frequency applications.
6. Q: What joining methods are compatible with metalized AlN substrates?
   A: Depending on the selected metal stack, metalized aluminum nitride substrates can support soldering, sintered silver, conductive adhesives and various wire bonding processes.

7. Q: Can I order small prototype quantities of metalized aluminum nitride substrate before mass production?
   A: It is possible to start with small prototype batches of metalized AlN substrates using the final layout, then move to larger volumes once the design and process window are confirmed.

8. Q: What information should I provide when requesting a quotation for metalized aluminum nitride substrates?
   A: For a precise quotation, it is helpful to send drawings or Gerber data, expected quantities, substrate thickness, metallization system preferences and any special requirements for flatness, via structures or testing on the metalized aluminum nitride substrate.

Customer Reviews about Metalized Aluminum Nitride Substrates

• ⭐️⭐️⭐️⭐️⭐️
  We switched several SiC inverter projects to a metalized aluminum nitride substrate from ADCERAX. The thermal margin improved and assembly scrap related to substrate warpage went down, which helped us stabilize our production schedule.
  -- Michael H., Power Module Design Manager, EnerDrive Systems GmbH
• ⭐️⭐️⭐️⭐️⭐️
  ADCERAX supplied metalized AlN substrates for our high-voltage DC/DC modules. The factory responded clearly to drawing changes, and the cost level stayed competitive for our annual volume.
  -- Laura P., Purchasing Manager, NorthWave Industrial Electronics Inc.
  
• ⭐️⭐️⭐️⭐️⭐️
  The metalized AlN substrate with fine-line patterns allowed us to integrate the RF matching network and power devices on one ceramic base. Measured temperature at rated output was several degrees lower than with the previous board.
  -- Ayoub (Purchasing Manager)
• ⭐️⭐️⭐️⭐️⭐️
  For our UV LED arrays, the metalized aluminum nitride ceramic substrate made it easier to keep junction temperatures under control. The customized pad layout matched our optics, so we could move to pilot production without redesigning the module.
  -- Kenji S., RF Hardware Engineer, WaveLink Communications Co., Ltd.