High Thermal Conductivity Silicon Carbide Ceramic Plate & Sheet for IGBT Modules

High thermal conductivity silicon carbide ceramic plate designed for efficient heat dissipation in power electronics, EV inverters, and laser cooling systems. Custom dimensions and surface finishes are available.

Catalogue No. AT-SIC-P1047
Material Silicon Carbide
Thermal Expansion Coefficient 4.0–5.0 ×10⁻⁶/K
Dimensional Tolerance ±0.1 mm (customizable)
Dimensions/Sizes Download PDF
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Silicon carbide thermal conductive ceramic plates are for demanding thermal management applications in power electronics, automotive control systems, and industrial laser equipment. With high thermal conductivity, low thermal expansion, and excellent mechanical strength, these plates provide reliable performance under high thermal loads.

Silicon Carbide Ceramic Plate Advantages

  • High thermal conductivity (≥120 W/m·K) ensures rapid heat transfer in high-power modules.
  • Excellent thermal shock resistance minimizes cracking during rapid temperature changes.
  • Electrically insulating and mechanically strong, suitable for high-voltage applications.
  • Dimensional precision up to ±0.1mm supports tight assembly tolerances.
  • Compatible with metalized surfaces for direct bonding or soldering.

Specifications of SiC Ceramic Plate

 

Silicon Carbide Tray for ICP
Item No. Length(mm) Width(mm) Thickness(%) Shape
AT-SIC-P1047 10 10 1.5 Tablet
AT-SIC-P1048 10 10 2 Tablet
AT-SIC-P1049 10 10 3 Tablet
AT-SIC-P1050 10 10 5 Tablet
AT-SIC-P1051 10 12 2.5 Tablet
AT-SIC-P1052 10 15 2 Tablet
AT-SIC-P1053 11 13 5 Ripple
AT-SIC-P1054 15 15 2 Tablet
AT-SIC-P1055 15 15 3 Tablet
AT-SIC-P1056 15 15 4 Tablet
AT-SIC-P1057 15 15 5 Tablet
AT-SIC-P1058 20 20 10 Tablet
AT-SIC-P1059 20 20 10 Groove
AT-SIC-P1060 20 20 2.5 Tablet
AT-SIC-P1061 20 20 2 Tablet
AT-SIC-P1062 20 20 5 Tablet
AT-SIC-P1063 20 20 5 Ripple
AT-SIC-P1064 25 25 10 Ripple
AT-SIC-P1065 25 25 2.5 Tablet
AT-SIC-P1066 25 25 3 Tablet
AT-SIC-P1067 25 25 5 Tablet
AT-SIC-P1068 25 25 5 Ripple
AT-SIC-P1069 25 25 8 Ripple
AT-SIC-P1070 30 30 10 Ripple
AT-SIC-P1071 30 30 2.5 Tablet
AT-SIC-P1072 30 30 5 Tablet
AT-SIC-P1073 30 30 5 Ripple
AT-SIC-P1074 30 30 8 Ripple
AT-SIC-P1075 35 35 10 Ripple
AT-SIC-P1076 40 40 3 Tablet
AT-SIC-P1077 40 40 4 Tablet
AT-SIC-P1078 40 40 5 Tablet
AT-SIC-P1079 40 40 5 Ripple
AT-SIC-P1080 40 40 7 Ripple
AT-SIC-P1081 40 40 8 Ripple
AT-SIC-P1082 50 50 5 Tablet
AT-SIC-P1083 50 50 5 With hole
AT-SIC-P1084 60 60 5 Tablet
AT-SIC-P1085 60 60 8 Tablet

 

 

Packing

  • Each heat sink is individually packed in anti-static foam
  • Sealed and moisture-proof packaging

Silicon Carbide Ceramic Sheet Properties

Item

Unit

Reaction-sintered SiC (SiSiC)

Silicon Nitride Bonded With SiC(NBSiC)

Sintered SiCn Without Pressure (SSiC)

SiC Content

%

85

80

99

Free  Silicon Content

%

15

0

0

Density

g/cm3

3.02

2.72

3.1-3.15

Max. Service Temp.

≤1380

1550

≤1600

Vickers Hardness

kg/mm2(HV)

2500

2500

2800

Coefficient of Thermal Expansion

K-1×10-6

4.5

5

4.1

Bending Strength

Mpa(20℃)

250

160

380

Mpa(1200℃)

280

180

400

Modulus of Elasticity

Gpa(20℃)

330

220

420

Gpa(1200℃)

300

/

/

Thermal Conductivity

W/m.k(1200℃)

45

15

74

Porosity

%

<0.1

12

<0.1

SiC Heat Ceramic Plate Applications

Silicon Carbide Ceramic Plate in Power Electronics Cooling

In EV inverter modules, IGBT power units, and laser diode systems, thermal management is critical. SiC ceramic plates are used as heat spreaders or substrates to dissipate heat efficiently while maintaining electrical insulation. Their high thermal conductivity and mechanical strength ensure stable operation under continuous thermal cycling.

Example: In a 1200V IGBT module, a 2mm thick SiC plate with 120 W/m·K thermal conductivity reduces junction temperature by 15°C compared to Al₂O₃ substrates, improving system reliability.

SiC Ceramic Plate Usage Instructions

  • Installation: Ensure flat contact with the heat source and the heat sink. Use thermal interface material (TIM) if needed.
  • Cleaning: Use isopropyl alcohol or deionized water. Avoid acidic or alkaline cleaners.
  • Storage: Store in a dry, dust-free environment. Avoid stacking without padding.
  • Handling: Avoid dropping or bending. Use gloves to prevent contamination.
  • Maintenance: Inspect for cracks or surface damage before reuse.

Common Misuse:

  • Over-tightening mounting screws may cause cracking.
  • Using incompatible TIMs may reduce thermal performance.
  1. Q: Can I request a custom size or shape?
    A: Yes, we support full customization based on your drawings or specifications.
  2. Q: Is the plate electrically insulating?
    A: Yes, it has a volume resistivity >10⁶ Ω·cm, suitable for high-voltage applications.
  3. Q: What is the typical lead time for custom orders?
    A:7–15 working days, depending on complexity and quantity.
  4. Q: Can the surface be metalized for soldering?
    A: Yes, we offer Ag or Cu metalized surfaces upon request.
  5. Q: How does it compare to AlN or Al₂O₃ in thermal conductivity?
    A: SiC offers higher thermal conductivity than Al₂O₃ and is comparable to AlN, with better mechanical strength.
  • ⭐️⭐️⭐️⭐️⭐️
    The performance remains stable under high-temperature conditions, with no deformation or cracking issues, thanks to the ceramic robotic arm we purchased from Adcerax.
    -- Whitney Romero (Engineer)
  • ⭐️⭐️⭐️⭐️⭐️
    The wear-resistant ceramic balls have a low breakage rate, high grinding efficiency, and do not affect the whiteness of the material
    -- Ayoub (Purchasing Manager)
  • ⭐️⭐️⭐️⭐️⭐️
    The wear-resistant ceramic balls have a low breakage rate, high grinding efficiency, and do not affect the whiteness of the material
    -- Ayoub (Purchasing Manager)
customize size

What You Can Specify: Silicon Carbide Ceramic Sheet

  • Outer/inner dimensions: ±0.1mm tolerance
  • Lengths: up to 1000mm
  • Thickness: 0.5mm to 20mm
  • End details: open, closed, beveled
  • Cross-section shape: square, rectangular, irregular
  • Surface finish: raw, polished, sandblasted
  • Optional: metalized surface (Ag, Cu) for bonding

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