High-Reflectance ZTA Substrate for UV/LED COB, Low Warp, Laser-Scribed Outline

Applications of Zirconia Toughened Alumina Substrates

• Power Electronics & Control (drivers, inverters, servo/PLC)

  ✅Key Advantages

  1. Edge-robust micro-features — supports vias/slots with lower chip risk in assembly.
  2. Stable print base — flatness/Ra window enhances thick-film pattern uniformity.
  3. Insulating carrier — maintains dielectric margin with mechanical strength balance.

  ✅ Problem Solved

  A control-board supplier shifted from standard alumina to ZTA for a slotted outline with multiple locator holes. After DFM and Ra/flatness alignment, rework related to edge chips and mis-prints dropped across pilot lots, and assembly takt normalized with consistent pick-and-place registration.

• LED/UV Modules (COB, UV curing, disinfection)

  ✅Key Advantages

  1. Edge-robust micro-features — supports vias/slots with lower chip risk in assembly.
  2. Stable print base — flatness/Ra window enhances thick-film pattern uniformity.
  3. Insulating carrier — maintains dielectric margin with mechanical strength balance.

  ✅ Problem Solved

  A control-board supplier shifted from standard alumina to ZTA for a slotted outline with multiple locator holes. After DFM and Ra/flatness alignment, rework related to edge chips and mis-prints dropped across pilot lots, and assembly takt normalized with consistent pick-and-place registration.

• Thick-Film Heaters & Sensors

  ✅Key Advantages

  1. Printability — Ra window compatible with thick-film pastes and resistor networks.
  2. Thermo-mechanical balance — toughness aids handling during post-fire steps.
  3. Laser versatility — micro-holes and scribe lines for assembly jigs and routing.

  ✅ Problem Solved

  A heater program needed fine resistor geometry and repeatable burn-in. ZTA substrates with lapped Ra and tight warp limits improved line yield during screen printing and reduced post-fire dimensional drift checks.

   

Usage Instructions of ZTA Substrates

• Install

  1. Verify flatness/warp vs. fixture plan; shim only within specified range.
  2. Align fiducials before printing/placement; confirm vacuum chuck contact on lapped side.
  3. Use edge-safe grippers; avoid point loads at micro-holes or slot ends.

• Use

  1. Match Ra and paste type; run a short DOE for print speed/snap-off and bake profile.
  2. For laser operations, validate pulse energy and pitch on sacrificial pieces first.
  3. If metallizing, control pre-clean, bake-out, and cure windows per paste and surface.

• Store

  1. Keep in original clean bags; control humidity and dust.
  2. Stack with interleaves; avoid cantilevered storage that induces warp over time.

• Clean

  1. Non-ionic detergent or solvent compatible with downstream paste/adhesive.
  2. DI water rinse and lint-free dry; avoid abrasive wipers on polished surfaces.

• Cautions

  1. Do not exceed specified clamp force on thin sections.
  2. Avoid thermal shock beyond validated ramp/soak profiles.
  3. Re-inspect Ra/flatness if re-lapping or rework occurs.

• Typical user pitfalls & fixes

  1. Issue: Print voids near slots → Fix: Reduce snap-off, adjust squeegee hardness, confirm local Ra.
  2. Issue: Lens misalignment on large panels → Fix: Tighten warp limit, use full-contact vacuum chuck.
  3. Issue: Edge chips at micro-holes → Fix: Add micro-chamfer, tune laser parameters, update handling jaws.

Zirconia Toughened Alumina Ceramic Substrate

1. Q: How should I define the minimum hole diameter for a ZTA ceramic substrate?
   A: For stability, the minimum laser-drilled via is typically ≥0.2 mm; smaller holes require pre-test to evaluate edge chipping and shape tolerance.
2. Q: Can ZTA ceramic substrates be used with both screen printing and DPC metallization?
   A: Yes, they are compatible with thick-film screen printing and can be post-processed for direct plated copper (DPC) after surface preparation.
3. Q: What is the typical dielectric strength of zirconia toughened alumina ceramic substrate?
   A: Average dielectric breakdown voltage is around 12–15 kV/mm, suitable for high-voltage insulation and multi-layer heater structures.
4. Q: Is there a color difference between standard alumina and ZTA substrates?
   A: ZTA has a slightly cream-white tone, while alumina is bright white; the difference does not affect reflectivity or optical uniformity in LED modules.
5. Q: Can the zirconia toughened alumina substrate be brazed or soldered directly?
   A: It can be metalized and plated (Ni/Au) for brazing or soldering; direct metal contact on bare ceramic is not recommended.
6. Q: What information should be included when requesting a quotation for ZTA substrates?
   A: Provide drawing with outline, thickness, tolerance, hole/slot data, Ra target, and quantity; note any metallization or inspection requirements for accurate cost evaluation.

What our Clients Say about Zirconia Toughened Alumina Ceramic Substrate

• ⭐️⭐️⭐️⭐️⭐️
  We qualified zirconia toughened alumina ceramic substrate panels with controlled warp for COB. ADCERAX supported laser fiducials and lapped Ra, which kept lens alignment within our tolerance window.
  -- Maria Alvarez, Sourcing Manager, Lumena Optics
• ⭐️⭐️⭐️⭐️⭐️
  Our heater build moved to a ZTA ceramic substrate to reduce edge chips at micro-holes. After DFM, screen printing stabilized and post-fire measurements stayed within plan.
  -- Daniel Chen, Process Engineer, Vector Motion Systems
• ⭐️⭐️⭐️⭐️⭐️
  ADCERAX as a factory supplier provided clean packaged ZTA blanks and quick engineering feedback. Dimensional reports matched our sampling plan, so release to line was straightforward.
  -- Hannah Cole, Operations Director, Northline Controls
• ⭐️⭐️⭐️⭐️⭐️
  For sensor carriers, the ZTA substrate with Ra control improved bonding repeats. The team handled serialization and small batches during pilot without disrupting our schedule.
  -- Takumi Sato, R&D Lead, Kairo Instruments