Alumina ceramic frames are square or rectangular structural borders made from approximately 95% Al₂O₃, used as insulating base parts and housings in industrial devices. They combine high mechanical strength, hardness, thermal stability and electrical insulation, so they can support and protect electronic components, sensors and actuators in harsh environments such as high temperature, high humidity or corrosive atmospheres.
Alumina Ceramic Frame Specifications
Type 1: Rectangular Alumina Ceramic Frame

| Rectangle Alumina Ceramic Frame | |||||
| Item No. | A(mm) | B(mm) | Width (mm) | Height (mm) | Purity (%) |
| AT-CF-F001 | 20 | 30 | 3 | 4 | 96-99 |
| AT-CF-F002 | 45 | 62 | 5 | 5 | 96-99 |
| AT-CF-F003 | 70 | 80 | 4 | 6 | 96-99 |
| AT-CF-F004 | 106 | 120 | 5 | 12 | 96-99 |
| AT-CF-F005 | 160 | 100 | 10 | 8 | 96-99 |
| AT-CF-F006 | 200 | 180 | 20 | 35 | 96-99 |
Type 2: Square Alumina Ceramic Frame

| Square Alumina Ceramic Frame | ||||
| Item No. | A = B (mm) | Width (mm) | Height (mm) | Purity (%) |
| AT-CF-Z001 | 20 | 5 | 5 | 96-99 |
| AT-CF-Z002 | 25 | 4 | 3 | 96-99 |
| AT-CF-Z003 | 30 | 3.5 | 8 | 96-99 |
| AT-CF-Z004 | 45 | 4.8 | 7.5 | 96-99 |
| AT-CF-Z005 | 60 | 12 | 16 | 96-99 |
| AT-CF-Z006 | 75 | 20 | 20 | 96-99 |
| AT-CF-Z007 | 86 | 15 | 15 | 96-99 |
| AT-CF-Z008 | 120 | 45 | 16 | 96-99 |
| AT-CF-Z009 | 130 | 30 | 18 | 96-99 |
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Material Data for Electrical and Thermal Selection
Select the exact alumina grade for the ordered frame. The values below describe dense material specimens; frame fit, working voltage, clamp load and thermal duty are established with the selected geometry and assembly acceptance.
Electrical properties
| Property/basis | 99.9% alumina | 99.7% alumina | 99.5% alumina | 99.0% alumina | 96% alumina | 95% alumina |
|---|---|---|---|---|---|---|
| Dielectric strength, kV/mm; typical; specimen basis | 10; 5 mm | 10; 5 mm | 10; 5 mm | 10; 5 mm | 8.3; AC, 6.35 mm | 10; 5 mm |
| Relative permittivity; 1 MHz; typical | 9.8 at 25°C | 9.8 at 25°C | 9.7 at 25°C | 9.6 at 25°C | 9.0 at room temperature | 9.4 at 25°C |
| Dissipation factor; 1 MHz | <0.0001 at 25°C | <0.0001 at 25°C | <0.0001 at 25°C | 0.0006 at 25°C | 0.0002 at 20°C | 0.0004 at 25°C |
| Volume resistivity, Ω·cm; 20°C | >10¹⁴ | >10¹⁴ | >10¹⁴ | >10¹⁴ | 10¹⁴; typical | >10¹² |
Heat Transfer and Expansion
| Property/basis | 99.9% alumina | 99.7% alumina | 99.5% alumina | 99.0% alumina | 96% alumina | 95% alumina |
|---|---|---|---|---|---|---|
| Thermal conductivity, W/(m·K); typical | 35–42 at 25°C | 35–40 at 25°C | 30–38 at 25°C | 24 at 25°C | 25 at 20°C | 18–25 at 25°C |
| Mean CTE, 10⁻⁶/K; stated interval | 7.6; 25–800°C | 7.6; 25–800°C | 7.6; 25–800°C | 7.2; 25–800°C | 8.2; 25–1000°C | 7.6; 25–800°C |
| Material service-temperature guide, °C; application-dependent | 1750 | 1700 | 1650 | 1600 | 1600 maximum in air | 1400 |
Composition and Mechanical Reference for Detailed Design
| Property/basis | 99.9% alumina | 99.7% alumina | 99.5% alumina | 99.0% alumina | 96% alumina | 95% alumina |
|---|---|---|---|---|---|---|
| Nominal Al₂O₃, wt% | 99.90 | 99.70 | 99.50 | 99.00 | 96 | 95 |
| IEC 60672-3 composition grouping | C799 | C799 | C799 | C795 | C795 | C795 |
| Density, g/cm³; typical | 3.94 | 3.94 | 3.90–3.92 | 3.80–3.91 | 3.70 | 3.75 |
| Flexural strength, MPa; 20°C; typical | 315–340 | 330 | 320–350 | 300–320 | 300 | 280 |
| Compressive strength, MPa; 20°C; typical | 2558–2900 | 2500 | 2400 | 2400 | 2000 | 2000 |
| Young’s modulus, GPa; typical | 359–375 | 370 | 365 | 355 | 275 at 20°C | 340 |
| KIC, MPa·m½; method-dependent | 3.8–4.2 | 3.6 | 3.5 | 3.3 | 3.5 at 20°C | 3.0 |
| Water absorption, %; selection limits except 96% | ≤0.01 | ≤0.05 | ≤0.10 | ≤0.10 | ≈0; typical, rounded | ≤0.20 |
*IEC C795/C799 identify composition groups. Strength, stiffness, toughness, density and water absorption support material comparison
Select the Window, Support and Mounting Together
A rigid ceramic border can provide electrical separation while locating a board or sensor around an open centre. The useful choice is the frame that fits the component, support faces and housing together.
| Decision | Product detail to compare | Customer benefit |
|---|---|---|
| Opening and border | Window size and position, beam width, thickness, radii and clearances. | Fits the board or sensing area while supporting the required contact zones. |
| Mounting and alignment | Holes, countersinks, slots, steps, housing datums and permitted movement. | Positions the part and accommodates the mating assembly. |
| Insulation path | Conductor edges, minimum ceramic thickness, creepage and clearance. | Matches electrical separation to the real geometry and environment. |
| Heat and expansion | Frame, PCB and housing temperatures, gradients, cycles and expansion allowance. | Supports the thermal duty with a suitable ceramic-to-housing fit. |
| Functional surfaces | Support-face finish, edge radii, cleanliness and chip/crack limits. | Provides controlled seating and handling at the surfaces that matter. |
*Use supported contacts, distributed clamp loads and drawing-defined corner relief for ceramic frames. Agree coating, metallisation, joining or assembly work explicitly when your supply item includes these features.
Packaging for Alumina Ceramic Frames
- Each alumina ceramic frame should be separated and protected to avoid edge impact, corner chipping and ceramic-to-ceramic contact during transport. Thin walls, machined windows, holes and polished surfaces can be packed with foam positioning, face protection and reinforced outer cartons according to order requirements.








