Our ceramic substrates deliver superior thermal management, electrical insulation & stability for demanding electronics. Choose Alumina, AlN, Zirconia, custom-engineered for peak performance. Solve heat & insulation challenges.
Ceramic Substrates Material
Silicon Carbide Ceramic Substrate
Silicon Nitride Ceramic Substrate
Metalized Ceramic Substrate
Ceramic Substrates Shape
Properties of Ceramic Substrate
- High Heat Resistance: Capable of withstanding temperatures up to 1000°C.
- Superior Thermal Conductivity: Excellent at transferring heat, ensuring efficiency in power-sensitive applications.
- Electrical Insulation: Provides reliable insulation in high-voltage environments.
- Chemical Stability: Resistant to corrosion and harsh chemicals, ensuring long-lasting performance.
Applications of Ceramic Substrate
Custom Technical Ceramic Substrate
That’s why we specialize in providing custom ceramic substrate solutions engineered to your precise specifications. Our capabilities include:
- Material Selection: Choose from a range of advanced ceramics including:
- Alumina (Al2O3) Substrates (96% – 99.9%): The workhorse material, offering a great balance of cost, thermal performance, and electrical insulation. Ideal for general-purpose applications, thick/thin film circuits.
- Aluminum Nitride (AlN) Substrates: For applications demanding the highest thermal conductivity, perfect for high-power LEDs, IGBT modules, and RF power amplifiers.
- Zirconia (ZrO2) Substrates: Known for exceptional mechanical toughness, chemical inertness, and biocompatibility, suitable for demanding structural components, sensors, and medical devices.
- Other technical ceramics available upon request.
- Precision Machining & Forming: We can produce complex shapes, sizes, thicknesses, through-holes (vias), cavities, and scoring lines to meet your design requirements.
- Metallization Options: Enhance your ceramic PCB substrate with various metallization techniques like DPC (Direct Plated Copper), DBC (Direct Bonded Copper), thick film printing (Ag, Au, Pt), and thin film sputtering for creating conductive traces, pads, and solderable surfaces.
FAQs About Ceramic Substrate
A Ceramic Substrate is a flat, thin sheet made from advanced ceramic materials like Alumina, Aluminum Nitride, or Zirconia. It serves as a foundational base for electronic circuits, components, and modules, providing excellent electrical insulation, mechanical support, and often, superior thermal management, especially in demanding applications where traditional PCB materials fall short.
Ceramic Substrates offer significant advantages over FR4, including much higher thermal conductivity for better heat dissipation, superior performance at high temperatures, a lower coefficient of thermal expansion (CTE) for better compatibility with semiconductor chips, excellent electrical insulation at high voltages, and greater mechanical stability and hermeticity. This makes Advanced Ceramic Substrates ideal for high-power, high-frequency, and harsh environment applications.
Absolutely. We specialize in providing Custom Ceramic Substrates. You can specify dimensions, thickness, material type, surface finish, machined features (like holes, slots, and scoring), and metallization patterns. Our engineering team can work with you to develop the perfect Ceramic Substrate solution for your unique application.
A High Thermal Conductivity Ceramic Substrate, such as one made from Aluminum Nitride (AlN), plays a crucial role in efficiently drawing heat away from active components like CPUs, LEDs, or power transistors. This improved thermal management prevents overheating, enhances device performance and reliability, and can extend the operational lifespan of your electronic devices, allowing for more compact and powerful designs.
We offer various metallization options to transform your Ceramic Substrate into a functional circuit board. Common methods include Thick Film printing (using pastes like Silver, Gold, Platinum), Thin Film sputtering/evaporation (for high-precision traces), Direct Plated Copper (DPC), and Direct Bonded Copper (DBC). The choice depends on your circuit's complexity, current carrying requirements, and operating frequency for your Metallized Ceramic Substrate.
A: Selecting the right Ceramic Substrate material depends on several factors:
- Thermal Management Needs: For high heat dissipation, Aluminum Nitride is preferred; Alumina is suitable for moderate needs.
- Operating Temperature: All our Ceramic Substrates perform well at high temperatures.
- Electrical Requirements: Consider dielectric constant, loss tangent, and insulation strength.
- Mechanical Properties: Strength, CTE compatibility with attached components.
- Cost: Alumina is generally more cost-effective than AlN. Our technical team can help you evaluate these factors to choose the optimal Ceramic Substrate.
Yes, our Ceramic Substrates, when appropriately metallized, are fully compatible with standard microelectronic assembly processes. This includes reflow soldering, die attach, wire bonding (gold or aluminum), and encapsulation, allowing for seamless integration into your manufacturing workflow.
An AlN Ceramic Substrate (Aluminum Nitride) is ideal for high-power density applications primarily due to its exceptionally high thermal conductivity (typically 170-230 W/m·K), which is significantly higher than Alumina and much closer to some metals. This allows the AlN Ceramic Substrate to rapidly spread and dissipate large amounts of heat generated by power semiconductors, preventing thermal runaway and ensuring stable operation. Additionally, its CTE is well-matched to silicon, reducing stress on semiconductor dies.
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